The Hong Kong Monetary Authority (HKMA) launched a digital bond subsidy program, with a maximum subsidy of HKD 2.5 million.

According to reports, the HKMA introduced the 'Digital Bond Subsidy Program' on November 28, as announced in the 2024 Policy Address, where each digital bond issued in Hong Kong can receive a maximum subsidy of HKD 2.5 million. The program is initially set for three years.

Previously, HKMA Chief Executive Eddie Yue stated that over USD 10 billion of tokenized bonds have been issued globally in the past decade. The Evergreen project has successfully moved beyond the proof of concept, and the next step will promote the widespread application of tokenized bonds in the market.

The HKMA supports the development of the tokenized market through the Ensemble sandbox, exploring use cases including fixed-income returns, investment funds, liquidity management, green finance, and supply chain financing.